US Patent Issued to Infineon Technologies on May 12 for "Power semiconductor module arrangement and housing for a power semiconductor module arrangement" (German Inventor)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,688, issued on May 12, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Power semiconductor module arrangement and housing for a power semiconductor module arrangement" was invented by Thomas Herbst (Arnsberg, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power semiconductor module arrangement includes a housing, at least one substrate arranged inside the housing and including a dielectric insulation layer and a first metallization layer arranged on a first side of the dielectric insulation layer, and a heat sink or base plate. The housing includes sidewalls and a cover and is attached to the heat sink or base plate. The sid...