US Patent Issued to Infineon Technologies on March 24 for "Semiconductor device comprising a semiconductor die and a carrier both covered by a parylene coating" (German Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,546, issued on March 24, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Semiconductor device comprising a semiconductor die and a carrier both covered by a parylene coating" was invented by Richard Knipper (Regensburg, Germany) and Thorsten Meyer (Regensburg, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a carrier comprising a recess, a semiconductor die disposed in the recess, and a parylene coating covering at least portions of the surfaces of the semiconductor die and the carrier."

The patent was filed on March 4, 2022, under Application No. 17/686,558.

*For further information, includi...