US Patent Issued to Infineon Technologies on March 24 for "Package, method for forming a package, chip card, and method for forming a chip card" (German Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,150, issued on March 24, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Package, method for forming a package, chip card, and method for forming a chip card" was invented by Jens Pohl (Bernhardswald, Germany) and Frank Puschner (Kelheim, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package including an electronic leadless module having a top side, a bottom side and side faces between the top side and the bottom side, the electronic leadless module having an electronic circuit, a plurality of electrical contact pads at the bottom side of the electronic leadless module which are electrically conductively coupled to the el...