US Patent Issued to Infineon Technologies on June 16 for "High current power module package with linear operation capabilities and sensing capabilities" (German, French Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,303, issued on June 16, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"High current power module package with linear operation capabilities and sensing capabilities" was invented by Benno Koeppl (Markt Indersdorf, Germany), Andre Mourrier (Manosque, France), Sebastian Thunich (Munich), David Jacquinod (La Fare les oliviers, France) and Stefan Schumi (Taufkirchen, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power module package may comprise a first metal oxide semiconductor field effect transistor (MOSFET), wherein the first MOSFET is configured to operate in a linear mode of operation when the first MOSFET is ON; a seco...