US Patent Issued to Infineon Technologies on Feb. 17 for "Semiconductor wireless transmitter/receiver with chip carrier having integrally formed antenna" (German, Austrian Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,670, issued on Feb. 17, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Semiconductor wireless transmitter/receiver with chip carrier having integrally formed antenna" was invented by Eduardo Schittler Neves (Olching, Germany), Rainer Markus Schaller (Saal a.d. Donau, Germany), Matthias Eberl (Taufkirchen, Germany) and Franz Michael Darrer (Graz, Austria).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device comprises a semiconductor chip and an electrically conductive chip carrier, wherein the semiconductor chip is mounted on the chip carrier. The semiconductor device furthermore comprises an electrically conductive e...