US Patent Issued to Infineon Technologies on Aug. 4 for "Encapsulated package with exposed electrically conductive structures and sidewall recess" (Malaysian Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,048, issued on Aug. 4, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Encapsulated package with exposed electrically conductive structures and sidewall recess" was invented by Chee Hong Lee (Paya Rumput, Malaysia), Soon Lock Goh (Malacca, Malaysia), Chai Chee Lee (Melaka, Malaysia), Swee Kah Lee (Melaka, Malaysia), Luay Kuan Ong (Melaka, Malaysia) and Chee Voon Tan (Seremban, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package is disclosed. In one example, the package includes an electronic component and an encapsulant encapsulating at least part of the electronic component. A first electrically conductive structure is ...