ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,716,856, issued on Aug. 25, was assigned to Infineon Technologies AG (Neubiberg, Germany).
"Method and device for monitoring thermal impedance" was invented by Daniel Domes (Werl, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of monitoring a thermal impedance of at least a portion of a thermal path between a semiconductor device having at least two output terminals and a heat sink s provided. The method includes causing power dissipation in the semiconductor device by reloading parasitic capacitances of the semiconductor device such that the at least two output terminals are at the same voltage level, measuring a first temperature in r...