US Patent Issued to Infineon Technologies on Aug. 18 for "Pre-molded lead frames for semiconductor packages" (Singaporean Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,939, issued on Aug. 18, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Pre-molded lead frames for semiconductor packages" was invented by Balehithlu Manjappaiah Upendra (Singapore), Romel Solanoy Lazala (Singapore), Dexter Inciong Reynoso (Singapore) and Mohamad Yazid Bin Wagiman (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "One example of a pre-molded lead frame includes a mold body, a plurality of recesses, a plurality of first leads, and a die pad. The mold body includes a first main surface and a second main surface opposite to the first main surface. Each recess of the plurality of recesses extends from the first ma...