ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,028, issued on Aug. 11, was assigned to Infineon Technologies AG (Neubiberg, Germany).
"Semiconductor module with meltable encapsulant zones" was invented by Anita Herzer (Kaiserslautern, Germany) and Markus Wiesemann (Bielefeld, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes a power electronics carrier including a metallization layer disposed on an electrically insulating substrate, a power semiconductor die mounted on the power electronics carrier, a housing that surrounds an interior volume over the power electronics carrier, an electrically insulating encapsulant within the interior volume that encapsulate...