US Patent Issued to Infineon Technologies on Aug. 11 for "Semiconductor device module comprising flexible leads for the purpose of height adjustment" (German Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,996, issued on Aug. 11, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Semiconductor device module comprising flexible leads for the purpose of height adjustment" was invented by Andreas Grassmann (Regensburg, Germany), Edward Fuergut (Dasing, Germany) and Uwe Schindler (Reichenbach, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device module includes an application board, a plurality of semiconductor device packages disposed on the application board, each one of the semiconductor device packages including a semiconductor die, a leadframe including a plurality of leads, the leads including a spring support a...