ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,059, issued on Aug. 11, was assigned to Infineon Technologies AG (Neubiberg, Germany).
"Power module having a multi-level lead frame" was invented by Dominic Raithel (Lappersdorf, Germany), Adrian Lis (Regensburg, Germany) and Thomas Schmid (Regensburg, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "A power module includes: a first substrate comprising a patterned first metallization; a second substrate comprising a patterned second metallization that faces the patterned first metallization; a first plurality of vertical power transistor dies having a drain pad attached to a first part of the patterned first metallization and a source pad el...