US Patent Issued to Infineon Technologies Canada on Aug. 11 for "Leaded package using routing layer for integrated circuit die" (Canadian, American Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,004, issued on Aug. 11, was assigned to Infineon Technologies Canada Inc. (Ottawa).

"Leaded package using routing layer for integrated circuit die" was invented by Mihalis Michael (San Jose, Calif.), Farzin Najafi (Ottawa), Mohammad Shafayet Zamil (Nepean, Canada) and Abhinandan Hemant Dixit (Kanata, Canada).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package for an integrated circuit die (e.g., a chip). A routing layer is layered between the chip and package contacts of the package. The chip has a planar surface along which the chip includes die contacts. The routing layer lies along the planar surface of the chip, and electrically connects the...