US Patent Issued to Infineon Technologies Austria on July 28 for "Surface mount package having an internal redundant electrical connection" (German, Austrian Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,824, issued on July 28, was assigned to Infineon Technologies Austria AG (Villach, Austria).

"Surface mount package having an internal redundant electrical connection" was invented by Ralf Otremba (Kaufbeuren, Germany), Edward Furgut (Dasing, Germany), Uwe Kirchner (Witra, Austria), Leo Aichriedler (Puch, Austria) and Florian Lindner (Munich).

According to the abstract* released by the U.S. Patent & Trademark Office: "A molded surface mount package includes: a power semiconductor die attached to a metallic pad with a first side facing the pad and a second (opposite) side facing away from the pad, the metallic pad forming a first power terminal exposed at a surface mounting side o...