US Patent Issued to Infineon Technologies Austria on July 21 for "Electronic device having a soldered joint between a metal region of a semiconductor die and a metal region of a substrate" (German Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,481, issued on July 21, was assigned to Infineon Technologies Austria AG (Villach, Austria).

"Electronic device having a soldered joint between a metal region of a semiconductor die and a metal region of a substrate" was invented by Kirill Trunov (Warstein, Germany), Alexander Heinrich (Bad Abbach, Germany), Konrad Roesl (Teublitz, Germany) and Arthur Unrau (Geseke, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes: a first semiconductor die having a metal region; a substrate having a plurality of metal regions; a first soldered joint between the metal region of the first semiconductor die and a first metal region ...