US Patent Issued to Infineon Technologies Austria on July 14 for "Semiconductor package and method for marking a semiconductor package" (Malaysian Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,179, issued on July 14, was assigned to Infineon Technologies Austria AG (Villach, Austria).

"Semiconductor package and method for marking a semiconductor package" was invented by Hwee Yin Low (Bukit Beruang, Malaysia), Badrus Hisham Abdul Rani (Muar Johor, Malaysia), Wee Aun Jason Lim (Melaka, Malaysia), Ai Yun Loh (Melaka Tengah, Malaysia) and Muhamad Hairul Fauzi Wahid (Melaka Tengah, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a semiconductor package is provided that includes a first package surface and a second package surface opposing the first surface, a plastic molding and one or more semiconductor dies. The fir...