US Patent Issued to Infineon Technologies Austria on Aug. 25 for "Semiconductor device having a detachable foil, power electronics arrangement, and method for fabricating a semiconductor device" (German Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,103, issued on Aug. 25, was assigned to Infineon Technologies Austria AG (Villach, Austria).

"Semiconductor device having a detachable foil, power electronics arrangement, and method for fabricating a semiconductor device" was invented by Gerardo Pantoja (Munich).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: at least one power semiconductor die; a substrate having a first side and an opposite second side, the at least one power semiconductor die being arranged over the first side; an encapsulation encapsulating the at least one power semiconductor die; a pre-cured lamination layer covering the second side of the subs...