ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,925, issued on Aug. 18, was assigned to Infineon Technologies Austria AG (Villach, Austria).
"Semiconductor device and method of manufacturing a semiconductor device" was invented by Mohamed Salleh Mohamed Saheed (Georgetown, Malaysia) and Murugalogeswaran Permal (Sungkai, Malaysia).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device is provided. The semiconductor device includes a substrate and an isolation region at a first main surface of the substrate. The isolation region includes a lower portion and an upper portion that protrudes from the lower portion. The semiconductor device further includes a charge shielding layer over a...