US Patent Issued to Infineon Technologies Austria on Aug. 18 for "Power semiconductor module arrangement comprising heat-conducting layer and heat sink and method for producing the same" (German Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,920, issued on Aug. 18, was assigned to Infineon Technologies Austria AG (Villach, Austria).

"Power semiconductor module arrangement comprising heat-conducting layer and heat sink and method for producing the same" was invented by Timo Bohnenberger (Neutraubling, Germany), Alexander Roth (Zeitlarn, Germany) and Alexander Heinrich (Bad Abbach, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power semiconductor module arrangement includes a power semiconductor module, wherein the power semiconductor module includes a substrate for carrying at least one semiconductor body, and a heat-conducting layer arranged on a lower surface of the power se...