US Patent Issued to Infineon Technologies Austria on Aug. 11 for "Power semiconductor package and method for fabricating the same" (German, Austrian Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,047, issued on Aug. 11, was assigned to Infineon Technologies Austria AG (Villach, Austria).

"Power semiconductor package and method for fabricating the same" was invented by Marcus Bohm (Mintraching, Germany), Stefan Wotzel (Erfurt, Germany), Andreas Grassmann (Sinzing, Germany), Bernd Schmoelzer (Radenthein, Austria) and Uwe Schindler (Reichenbach, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power semiconductor package comprises a leadframe comprising a first die pad, a second die pad and a plurality of external contacts. The first and second die pads are separated by a first gap. A power semiconductor die is arranged on and electrica...