US Patent Issued to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE on June 23 for "Thermal decomposition apparatus and thermal decomposition method applying the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,749, issued on June 23, was assigned to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (Hsinchu, Taiwan).

"Thermal decomposition apparatus and thermal decomposition method applying the same" was invented by Teng-Yu Wang (Hsinchu City, Taiwan) and Chih-Lung Lin (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thermal decomposition apparatus includes a heating zone, a cooling zone, a first conveying mechanism and a second conveying mechanism. The heating zone has a first space, a first inlet and a first outlet. The first inlet and the first outlet are located at two opposite sides of the first space. The cooling zone has a second space...