ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,694, issued on July 14, was assigned to Industrial Technology Research Institute (Hsinchu, Taiwan).
"Package structure" was invented by Yu-Wei Huang (Chiayi City, Taiwan), Ching-Feng Yu (Miaoli County, Taiwan) and Chih-Cheng Hsiao (Hsinchu County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure, including a circuit board, multiple circuit structure layers, at least one bridge structure, and at least one supporting structure, is provided. The circuit structure layer is disposed on the circuit board. The bridge structure is connected between the two adjacent circuit structure layers. The supporting structure is located betwee...