US Patent Issued to Industrial Technology Research Institute on Aug. 25 for "Optical chip structure and optical communication package" (Taiwanese Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,717,089, issued on Aug. 25, was assigned to Industrial Technology Research Institute (Hsinchu, Taiwan).

"Optical chip structure and optical communication package" was invented by Sin-Jhu Wun (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An optical chip structure is adapted for coupling an optical fiber array. The optical fiber array includes optical fibers arranged side by side. The optical chip structure includes an optical fiber coupling substrate, optical fiber accommodation grooves, and stoppers. The optical fiber accommodating grooves are adapted to accommodate the optical fiber array. The optical fiber accommodating groove...