US Patent Issued to Inari Technology Sdn Bhd on March 24 for "Apparatus, system and method for determining a match condition for a printed circuit board to a stencil" (Malaysian Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,586,175, issued on March 24, was assigned to Inari Technology Sdn Bhd (Bayan Lepas, Malaysia).

"Apparatus, system and method for determining a match condition for a printed circuit board to a stencil" was invented by Chin Chooi Chng (Bayan Lepas, Malaysia), Sabran Bin Samsuri (Bayan Lepas, Malaysia) and Sze Theng Chin (Kulim, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for determining the condition of a printed circuit board, including a stencil database for storing a plurality of stencil data files corresponding to stencils of different dimensions, an image capturing device having an area where the printed circuit board is lai...