US Patent Issued to IMEC VZW on Feb. 17 for "Integrated circuit chip including back side power delivery tracks" (Belgian Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,634, issued on Feb. 17, was assigned to IMEC VZW (Leuven, Belgium).

"Integrated circuit chip including back side power delivery tracks" was invented by Eric Beyne (Heverlee, Belgium), Anne Jourdain (Grez-Doiceau, Belgium) and Anabela Veloso (Leuven, Belgium).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) chip is provided. In one aspect, a semiconductor substrate includes active devices at its front surface and power delivery tracks on its back surface. The active devices are powered through mutually parallel buried power rails, with the power delivery tracks running transversely with respect to the power rails, and connecte...