US Patent Issued to Illumina on March 3 for "Thermoformed, injection molded, and/or overmolded microfluidic structures and techniques for making the same" (Singaporean, American Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,564,995, issued on March 3, was assigned to Illumina Inc. (San Diego).

"Thermoformed, injection molded, and/or overmolded microfluidic structures and techniques for making the same" was invented by Paul M. Crivelli (San Diego), Cyril M. L. Delattre (San Diego), Gerald Kreindl (Singapore) and Wesley A. Cox-Muranami (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Laminated microfluidic structures and methods for manufacturing the same are provided. In some instances, a laminated microfluidic structure is provided which includes a distended region having a sipper port at the bottom and an internal channel that fluidically connects the sipper port...