US Patent Issued to II-VI Advanced Materials on July 28 for "Crystalline wafers and process for forming crystalline wafers" (Delaware Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,692, issued on July 28, was assigned to II-VI Advanced Materials LLC (Pine Brook, N.J.).

"Crystalline wafers and process for forming crystalline wafers" was invented by Y.K. Chen (Wilmington, Del.), Charles D. Tanner (Wilmington, Del.) and Jeremy Turcaud (Wilmington, Del.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods of forming a crystalline wafers or films such as a diamond wafer or film are disclosed. Such a method may include creating a damaged layer in a seed wafer at a depth from a seed wafer upper surface. The seed wafer may include a diamond crystalline structure. The method may also include growing a diamond epitaxial layer on the s...