ALEXANDRIA, Va., April 21 -- United States Patent no. 12,607,416, issued on April 21, was assigned to IHI Corp. (Tokyo).
"Flow rate adjustment device" was invented by Zhihong Liu (Tokyo) and Atsushi Ishikawa (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A flow rate adjustment device includes: an adjustment unit including a pipe and a sealing plate provided below an outlet of the pipe, the sealing plate having a sealing surface; and a moving unit that moves the sealing plate to a sealing position where the sealing surface of the sealing plate is positioned vertically below the outlet of the pipe and a retraction position where the sealing surface of the sealing plate is retracted from a point vertical...