US Patent Issued to IEIT SYSTEMS on Oct. 20 for "Memory capacity expansion of a memory module" (Chinese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,769,445, issued on Oct. 20, was assigned to IEIT SYSTEMS Co. LTD. (Shandong, China).

"Memory capacity expansion of a memory module" was invented by Xi Chen (Jinan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure belongs to the technical field of storage chip designs. Disclosed are a memory module and an electronic device. The memory module includes at least two memory expander controller (MXC) chips, a peripheral component Interconnect express (PCIe) golden finger, a multichannel input/output (MCIO) connector, and a dual inline memory module (DIMM), wherein the MXC chips are connected to the DIMM through a double data rate 5 ...