US Patent Issued to IEE INTERNATIONAL ELECTRONICS & ENGINEERING on Sept. 8 for "Method of furnishing three-dimensional objects with electrically conductive structures having low topography and low surface roughness" (Luxembourger, German Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,110, issued on Sept. 8, was assigned to IEE INTERNATIONAL ELECTRONICS & ENGINEERING S.A. (Echternach, Luxembourg).

"Method of furnishing three-dimensional objects with electrically conductive structures having low topography and low surface roughness" was invented by Michael Olk (Welschbillig-Trag, Germany), Driss Chabach (Noertrange, Luxembourg) and Pascal Schmalen (Berdorf, Luxembourg).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of producing an assembly of structured members comprises: providing a flat substrate from plastic material; printing on the substrate tracks of a first thickness and corresponding to an intended course of the st...