US Patent Issued to IDEMITSU KOSAN on July 14 for "Thermosetting composition for injection molding, method for producing molded article using the same, and cured product" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,679,009, issued on July 14, was assigned to IDEMITSU KOSAN Co. LTD. (Tokyo).

"Thermosetting composition for injection molding, method for producing molded article using the same, and cured product" was invented by Yutaka Obata (Tokyo), Yasunari Okada (Tokyo), Katsuki Ito (Tokyo) and Kazuki Watanabe (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thermosetting composition for injection molding comprising: (A) a di(meth)acrylate compound having structural units represented by the formulas (A1), and (B) a thermal polymerization initiator."

The patent was filed on April 6, 2022, under Application No. 18/285,817.

*For further information, including...