US Patent Issued to IDEMIA FRANCE on March 31 for "Method for fabricating an assembly for a card and a card comprising a metallized film, a microcircuit card and an assembly for said card" (French Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,589,583, issued on March 31, was assigned to IDEMIA FRANCE (Courbevoie, France).

"Method for fabricating an assembly for a card and a card comprising a metallized film, a microcircuit card and an assembly for said card" was invented by Sylvie Pompeani (Courbevoie, France) and Joseph Guyon Le Bouffy (Courbevoie, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for fabricating a metallized assembly for a microcircuit card exhibiting a metallized effect, the assembly forming an internal layer of the card. The method comprises providing a support layer formed of a plastic material sensitive to heat exhibiting a first shrinkage ratio, the supp...