US Patent Issued to iCometrue on May 19 for "Field programmable multichip package based on field-programmable-gate-array (FPGA) integrated-circuit (IC) chip" (Taiwanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,633,338, issued on May 19, was assigned to iCometrue Co. Ltd. (Hsinchu County, Taiwan).

"Field programmable multichip package based on field-programmable-gate-array (FPGA) integrated-circuit (IC) chip" was invented by Mou-Shiung Lin (Hsinchu, Taiwan) and Jin-Yuan Lee (HsinChu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor IC chip comprising: a silicon substrate; a first transistor at a top surface of the silicon substrate; a first through silicon via (TSV) vertically in the silicon substrate; a second through silicon via (TSV) vertically in the silicon substrate; a first interconnection scheme on the top surface of the silicon sub...