US Patent Issued to ICLEAGUE TECHNOLOGY on April 21 for "Semiconductor structure and method for forming semiconductor structure" (Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,539, issued on April 21, was assigned to ICLEAGUE TECHNOLOGY Co. LTD. (Jiaxing, China).

"Semiconductor structure and method for forming semiconductor structure" was invented by Wenyu Hua (Jiaxing, China), Fandong Liu (Jiaxing, China) and Xiao Ding (Jiaxing, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure and a formation method therefor. The semiconductor structure comprises: a substrate, which has opposite first and second surfaces, and comprises several discrete active areas arranged in a first direction and parallel to a second direction, wherein the first direction is perpendicular to the second direction; word lin...