US Patent Issued to IBIDEN on Oct. 27 for "Wiring substrate having optical wiring part" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,775,136, issued on Oct. 27, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).

"Wiring substrate having optical wiring part" was invented by Masatoshi Kunieda (Ibi-gun, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes an electrical wiring part including insulating layers and conductor layers, and an optical wiring part formed on a surface of the electrical wiring part and including a support plate and an optical waveguide formed on the support plate. The optical wiring part is formed such that the optical waveguide includes at least one core part that transmits light and a cladding part surrounding the at least one core part...