ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,384, issued on Oct. 20, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).
"Method for manufacturing wiring substrate" was invented by Yasushi Usami (Ogaki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a wiring substrate includes preparing a first support plate having a metal foil formed on surface of a support substrate, forming a wiring substrate on the foil such that the wiring substrate has first surface facing the foil, attaching a second support plate to second surface of the wiring substrate, and separating the support substrate from the foil after attaching the second support plate such that the foil is remove...