US Patent Issued to IBIDEN on Nov. 3 for "Wiring substrate" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,169, issued on Nov. 3, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).

"Wiring substrate" was invented by Masashi Kuwabara (Ibi-gun, Japan), Jun Sakai (Ogaki, Japan) and Shiho Fukushima (Ibi-gun, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes a core substrate including a through-hole conductor, a first resin insulating layer, a first conductor layer including a seed layer and an electrolytic plating layer, a via conductor formed such that the via conductor electrically connects the through-hole conductor and first conductor layer, and a second resin insulating layer covering the first conductor layer. The core substr...