ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,179, issued on Nov. 3, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).
"Method for manufacturing wiring substrate" was invented by Michimasa Takahashi (Ogaki, Japan), Hideyuki Goto (Ogaki, Japan), Kiyohiro Ishikawa (Ogaki, Japan) and Ayami Ohno (Ogaki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a wiring substrate includes preparing a substrate including an insulating layer and metal foils, forming a through hole in the substrate to penetrate through the insulating layer and foils, forming a first plating film on the substrate such that the first film is formed on the entire surface of each metal foil and the inner...