ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,400, issued on March 31, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).
"Wiring substrate" was invented by Toshiki Furutani (Ibi-gun, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes a core substrate, a first build-up part formed on a first surface of the substrate and including insulating layers and conductor layers, and a second build-up part formed on a second surface of the substate on the opposite side with respect to the first surface and including insulating layers and conductor layers. The first build-up part includes a first region and a second region such that a distance between adjacent conductor layers i...