US Patent Issued to IBIDEN on March 17 for "Printed wiring board" (Japanese Inventor)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,597, issued on March 17, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).

"Printed wiring board" was invented by Susumu Kagohashi (Ogaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on the resin insulating layer and including a seed layer and an electrolytic plating layer, and a via conductor connecting the first conductor layer and the second conductor layer and including the seed layer and electrolytic plating layer extending from the second conductor layer. The second conductor layer and v...