US Patent Issued to IBIDEN on July 28 for "Wiring substrate" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,392, issued on July 28, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).

"Wiring substrate" was invented by Toshiki Furutani (Ogaki, Japan), Kyohei Yoshikawa (Ogaki, Japan), Takuya Inishi (Ogaki, Japan) and Jun Sakai (Ogaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes a core substrate including a through-hole conductor, a resin insulating layer formed on the core substrate, a conductor layer formed on a surface of the resin insulating layer and including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor formed in the resin insulating layer such that the via conductor is c...