US Patent Issued to IBIDEN on July 14 for "Wiring substrate" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,686, issued on July 14, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).

"Wiring substrate" was invented by Masataka Kato (Ogaki, Japan), Shunsuke Sakai (Ogaki, Japan), Masahide Tawatari (Ogaki, Japan) and Kosuke Ikeda (Ogaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes a core substrate, a build-up part formed on a surface of the substrate and including insulating layers and conductor layers, and a covering insulating layer formed on the build-up part such that the covering layer is covering the outermost surface of the build-up part. The build-up part is formed such that the insulating layers include a first insu...