US Patent Issued to IBIDEN on Aug. 4 for "Wiring substrate" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,023, issued on Aug. 4, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).

"Wiring substrate" was invented by Toshiki Furutani (Ibi-gun, Japan) and Masashi Kuwabara (Ibi-gun, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes a first build-up part includes first insulating layers, first conductor layers and first via conductors, and a second build-up part laminated to the first build-up part and including second insulating layers, second conductor layers and second via conductors. The first conductor layers in the first build-up part and the second conductor layers in the second build-up part include wirings such that a wiri...