US Patent Issued to IBIDEN on Aug. 4 for "Wiring substrate" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,658, issued on Aug. 4, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).

"Wiring substrate" was invented by Masashi Kuwabara (Ibi-gun, Japan) and Susumu Kagohashi (Ogaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes a core substrate having a through-hole conductor, a resin insulating layer formed on the core substrate, a conductor layer formed on the insulating layer and including a seed layer and an electrolytic plating layer, and a via conductor formed in the insulating layer. The via conductor electrically connects the through-hole conductor and conductor layer. The via conductor includes the seed layer and electr...