US Patent Issued to IBIDEN on Aug. 25 for "Wiring substrate" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,200, issued on Aug. 25, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).

"Wiring substrate" was invented by Toshiki Furutani (Ibi-gun, Japan), Masashi Kuwabara (Ibi-gun, Japan), Jun Sakai (Ogaki, Japan) and Takuya Inishi (Ogaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes a first build-up part including first insulating layers and conductor layers, a second build-up part laminated to the first part and including second insulating layers and conductor layers, and via conductors including first via conductors in the first insulating layers and second via conductors in the second insulating layers. The first part is ...