US Patent Issued to IBIDEN on Aug. 11 for "Wiring substrate having multiple build-up parts" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,006, issued on Aug. 11, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).

"Wiring substrate having multiple build-up parts" was invented by Masashi Kuwabara (Ibi-gun, Japan) and Susumu Kagohashi (Ogaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes a first build-up part including first insulating and conductor layers, and via conductors, and a second build-up part including second insulating and conductor layers. The minimum wiring width in the first conductor layers is smaller than the minimum wiring width in the second conductor layers. The minimum inter-wiring distance in the first conductor layers is smaller than...