US Patent Issued to IBIDEN on Aug. 11 for "Wiring substrate and method for manufacturing the same" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,560, issued on Aug. 11, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).

"Wiring substrate and method for manufacturing the same" was invented by Shunsuke Sakai (Ogaki, Japan) and Koji Okabe (Ogaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes a substrate, and a conductor layer formed on the substrate and including copper such that the conductor layer is patterned. The conductor layer is formed such that the upper surface of the conductor layer has a width that is equal to or larger than a width of the lower surface of the conductor layer and that the width of the lower surface is larger than the minimum width of a...