ALEXANDRIA, Va., March 17 -- United States Patent no. 12,582,008, issued on March 17, was assigned to Hyundai Motor Co.; (Seoul, South Korea) and Kia Corp. (Seoul, South Korea).
"Power module" was invented by Suk Hyun Lim (Hwaseong-Si, South Korea) and Jun Hee Park (Hwaseong-Si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A power module include at least one substrate including an insulating layer and a metal circuit disposed on a first side of the insulating layer, a semiconductor chip, and at least one vapor chamber including a fluid flowing therein and disposed between the semiconductor chip and one of the at least one substrate, wherein each of the at least one vapor chamber includes a firs...