US Patent Issued to HYUNDAI MOTOR, KIA on Sept. 8 for "Heat pump system for a vehicle" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,728,700, issued on Sept. 8, was assigned to HYUNDAI MOTOR COMPANY (Seoul, South Korea) and KIA Corp. (Seoul, South Korea).

"Heat pump system for a vehicle" was invented by Seong-Bin Jeong (Seongnam-si, South Korea), Dongseok Oh (Hwaseong-si, South Korea), Jae-Eun Jeong (Hwaseong-si, South Korea), Yong Woong Cha (Yongin-si, South Korea) and Wan Je Cho (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat pump system for a vehicle may include: a compressor configured to compress a refrigerant; and a heat, ventilation, and air condition (HVAC) module including an internal condenser, an evaporator connected to the compressor via a ...