ALEXANDRIA, Va., May 12 -- United States Patent no. 12,623,511, issued on May 12, was assigned to Hyundai Motor Co. (Seoul, South Korea) and Kia Corp. (Seoul, South Korea).
"Heat pump system for vehicle" was invented by Jeawan Kim (Hwaseong-si, South Korea), Hochan An (Hwaseong-si, South Korea), Yeonho Kim (Seoul, South Korea), Man Hee Park (Suwon-si, South Korea), Yeong Jun Kim (Incheon, South Korea), Jae Yeon Kim (Hwaseong-si, South Korea) and Hoyoung Jeong (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment heat pump system for a vehicle includes a compressor that compresses a refrigerant, a condenser connected to the compressor through a refrigerant line that condenses ...