ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,715,523, issued on Aug. 25, was assigned to HYUNDAI MOTOR COMPANY (Seoul, South Korea), KIA Corp. (Seoul, South Korea) and SHB Automotive Module Co. Ltd. (Gyeongsan-si, South Korea).
"Dual spoiler apparatus" was invented by Hong Heui Lee (Suwon-si, South Korea), Jin Young Yoon (Gimpo-si, South Korea), Dong Eun Cha (Hwaseong-si, South Korea), Dong Ha Kim (Gwacheon-si, South Korea), Jeong Bok Lee (Gyeongsan-si, South Korea), Sung Hoon Son (Gyeongsan-si, South Korea) and Bo Hwan Cha (Gyeongsan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A dual spoiler apparatus changes a tilting angle and a length of an air spoiler to control the air flo...